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Built-in fault-tolerant computing paradigm for resilient large-scale chip design: a self-test, self-diagnosis, and self-repair-based approach
by Li [et al.]Published by: Switzerland : Springer , 2023
- Sublocation
- EGC
- Call Number
- 621.395 B868 2023
- Physical Desc.
- xviii, 304 p.
- Note
- Includes bibliographic references.
- ISBN
- 978-981-19-8551-5
- Copies
- —