Laguna University Digital Library
Discover books, e-journals, theses, and special collections — all in one place.
3D microelectronic packaging: from architectures to applications
by Li, Yan and Goyal, DeepakPublished by: Switzerland : Springer , 2017
- Sublocation
- EGC
- Call Number
- 621.3815 L612t 2017
- Edition
- 2nd ed.
- Physical Desc.
- xvii, 622 p.
- ISBN
- 978-981-15-7090-2
- Copies
- —